Surface Mounted Device
Facilitan la automatización del proceso de ensamblaje, así como el aumento de la densidad de integración debido a la miniaturización de los componentes.
- CDIPCeramic Dual In-line Package
- DIPDual In-line Package
- HSIPSingle In-line Package with Heatsink
- ICIntegrated Circuit
- MSOPMini Small Outline Package
- Printed Circuit BoardPCB
- QFPQuad Flat Package
- QSOPQuarter Small Outline Package
- SDIPShrink Dual In-line Package
- SIPSingle Inline Package
- SIPPSingle In-line Pin Package
- SMDSurface Mounted Device
- SOJSmall Outline J-Lead Package
- SONSmall Outline Non-leaded package
- SOPSmall Outline Package
- SSIPShrink Single In-line Package
- SSOPShrink Small Outline Package
- SZIPShrink Zigzag In-line Package
- TQFPThin Quad Flat Package
- TSOPThin Small Outline Package
- TSSOPThin-Shrink Small Outline Package
- VSONVery-thin Small Outline Non-leaded package
- WDIPWindow DIP
- ZIPZig-zag In Line Package